Development of low viscosity, high dielectric constant (k) polymers for integral passive applications

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 169-173

  Troutman, T S ^a   Bhattacharya, S ^a   Tummala, Rao ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL MILLING; CERAMIC MATERIALS; COMPOSITE MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRONICS PACKAGING; HIGH-K DIELECTRIC; INTERFACES (MATERIALS); MAGNESIUM; MAGNESIUM POWDER; NIOBIUM COMPOUNDS; PACKAGING MATERIALS; PERMITTIVITY; POLYMERS; POWDERS; VISCOSITY;

COMPONENT DIMENSIONS; DECOUPLING CAPACITOR; DIELECTRIC CONSTANT VALUES; ELECTRICAL PERFORMANCE; HIGH DIELECTRIC CONSTANTS; LEAD MAGNESIUM NIOBATE; LEAD MAGNESIUM NIOBATE-LEAD TITANATES; POLYMER CERAMIC COMPOSITE;

DIELECTRIC MATERIALS;

EID: 33644809002     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757306     Document Type: Conference Paper

References (7)

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