Using buried capacitor in LTCC-MLC balun

Electronics Letters

Volumn 38, Issue 15, 2002, Pages 801-803

  Tang, Ching Wen ^a   Chang, Chi Yang ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); CAPACITORS; CERAMIC MATERIALS; COMPUTER SIMULATION; COUPLED CIRCUITS; MIXER CIRCUITS; MULTILAYERS; RESONATORS; TRANSMISSION LINE THEORY;

CERAMIC BALUN; COUPLED TRANSMISSION LINES; MULTILAYER CERAMIC;

MICROWAVE DEVICES;

EID: 0037130393     PISSN: 00135194     EISSN: None     Source Type: Journal    
DOI: 10.1049/el:20020586     Document Type: Article

References (9)

1. Active balun
2. Lumped parameter balun
3. Balun transformer core material, balun transformer core and Balun transformer
4. Chip type spiral broadside coupled directional couplers and baluns using low temperature co-fired ceramic
5. A design of the ceramic chip balun using the multilayer configuration
6. Chip type LTCC-MLC baluns using stepped impedance method
7. High-dielectric constant stripline band-pass filters
8. A reduced size planar balun structure for wireless microwave and RF applications