Chip-type LTCC-MLC baluns using the stepped impedance method

IEEE Transactions on Microwave Theory and Techniques

Volumn 49, Issue 12, 2001, Pages 2342-2349

  Tang, Ching Wen ^a   Sheen, Jyh Wen ^b   Chang, Chi Yang ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Balun; Chip type component; LTCC; MLC; Multisection coupled lines; Stepped impedance method

Indexed keywords

MULTILAYER CERAMIC (MLC) BALUN;

BANDWIDTH; COMPUTER SIMULATION; ELECTRIC IMPEDANCE; ELECTRIC LINES;

MICROWAVE DEVICES;

EID: 0035686658     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: 10.1109/22.971619     Document Type: Conference Paper

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