Surface metallization of alumina ceramics by pulsed high energy density plasma process

Applied Surface Science

Volumn 200, Issue 1-4, 2002, Pages 104-110

  Rong, Chun ^a   Zhang, Jizhong ^a,b   Liu, Chizi ^c   Yang, Size ^c  

^a TSINGHUA UNIVERSITY   (China)

^b INTERNATIONAL CENTRE FOR MATERIALS PHYSICS   (China)

^c INSTITUTE OF PHYSICS   (China)

Author keywords

Alumina ceramics; Copper film; CuAl 2 O 4; Metallization; Pulsed plasma

Indexed keywords

ALUMINA; CERAMIC MATERIALS; CHEMICAL BONDS; CHEMICAL VAPOR DEPOSITION; COPPER; DIFFUSION; HIGH TEMPERATURE EFFECTS; METALLIC FILMS; METALLIZING; PLASMA APPLICATIONS; QUENCHING; REACTION KINETICS; SUBSTRATES; SYNTHESIS (CHEMICAL); X RAY DIFFRACTION ANALYSIS;

PULSED HIGH ENERGY DENSITY PLASMAS (PHEDP);

SURFACE TREATMENT;

EID: 0037110949     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0169-4332(02)00874-7     Document Type: Article

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