Automated post bonding inspection by using machine vision techniques

International Journal of Production Research

Volumn 40, Issue 12, 2002, Pages 2835-2848

  Wang, Mao Jiun J ^a   Wu, Wen Yen ^b   Hsu, Chih Cheng ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b I SHOU UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COMPUTER VISION; DEFECTS; IMAGE PROCESSING; INSPECTION; SEMICONDUCTOR DEVICE MANUFACTURE; WIRE;

WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 0037103438     PISSN: 00207543     EISSN: None     Source Type: Journal    
DOI: 10.1080/00207540210136568     Document Type: Article

References (15)

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