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The applications of mesoscale self-assembly include forming 3D microstructures [(a) Clark, T. D.; Tien, J.; Duffy, D. C.; Paul, K. E.; Whitesides, G. M. J. Am. Chem. Soc. 2001, 123, 7677-7682]; forming electrical networks [(b) Gracias, D. H.: Tien, J.; Breen, T. L.; Hsu, C.; Whitesides, G. M. Science 2000, 289, 1170-1172. (c) Boncheva, M.; Gracias, D. H.; Jacobs, H. O.; Whitesides, G. M. Proc. Natl. Acad. Sci. U.S.A. 2002, 99, 4937-4940. (d) Jacobs, H. O.; Tao, A. R.; Schwartz, A.; Gracias, D. H.; Whitesides, G. M. Science 2002, 296, 323-325]; performing logical computations [(e) Rothemund, P. W. K. Proc. Natl. Acad. Sci. U.S.A. 2000, 97, 984-989]; and modeling materials [(f) Thalladi, V. R.; Schwartz, A.; Phend, J. N.; Hutchinson, J. W.; Whitesides, G. M. J. Am Chem. Soc. 2002, 124, 9912-9917].
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0034682874
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The applications of mesoscale self-assembly include forming 3D microstructures [(a) Clark, T. D.; Tien, J.; Duffy, D. C.; Paul, K. E.; Whitesides, G. M. J. Am. Chem. Soc. 2001, 123, 7677-7682]; forming electrical networks [(b) Gracias, D. H.: Tien, J.; Breen, T. L.; Hsu, C.; Whitesides, G. M. Science 2000, 289, 1170-1172. (c) Boncheva, M.; Gracias, D. H.; Jacobs, H. O.; Whitesides, G. M. Proc. Natl. Acad. Sci. U.S.A. 2002, 99, 4937-4940. (d) Jacobs, H. O.; Tao, A. R.; Schwartz, A.; Gracias, D. H.; Whitesides, G. M. Science 2002, 296, 323-325]; performing logical computations [(e) Rothemund, P. W. K. Proc. Natl. Acad. Sci. U.S.A. 2000, 97, 984-989]; and modeling materials [(f) Thalladi, V. R.; Schwartz, A.; Phend, J. N.; Hutchinson, J. W.; Whitesides, G. M. J. Am Chem. Soc. 2002, 124, 9912-9917].
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5
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0037117450
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The applications of mesoscale self-assembly include forming 3D microstructures [(a) Clark, T. D.; Tien, J.; Duffy, D. C.; Paul, K. E.; Whitesides, G. M. J. Am. Chem. Soc. 2001, 123, 7677-7682]; forming electrical networks [(b) Gracias, D. H.: Tien, J.; Breen, T. L.; Hsu, C.; Whitesides, G. M. Science 2000, 289, 1170-1172. (c) Boncheva, M.; Gracias, D. H.; Jacobs, H. O.; Whitesides, G. M. Proc. Natl. Acad. Sci. U.S.A. 2002, 99, 4937-4940. (d) Jacobs, H. O.; Tao, A. R.; Schwartz, A.; Gracias, D. H.; Whitesides, G. M. Science 2002, 296, 323-325]; performing logical computations [(e) Rothemund, P. W. K. Proc. Natl. Acad. Sci. U.S.A. 2000, 97, 984-989]; and modeling materials [(f) Thalladi, V. R.; Schwartz, A.; Phend, J. N.; Hutchinson, J. W.; Whitesides, G. M. J. Am Chem. Soc. 2002, 124, 9912-9917].
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Jacobs, H.O.3
Whitesides, G.M.4
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0037066541
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The applications of mesoscale self-assembly include forming 3D microstructures [(a) Clark, T. D.; Tien, J.; Duffy, D. C.; Paul, K. E.; Whitesides, G. M. J. Am. Chem. Soc. 2001, 123, 7677-7682]; forming electrical networks [(b) Gracias, D. H.: Tien, J.; Breen, T. L.; Hsu, C.; Whitesides, G. M. Science 2000, 289, 1170-1172. (c) Boncheva, M.; Gracias, D. H.; Jacobs, H. O.; Whitesides, G. M. Proc. Natl. Acad. Sci. U.S.A. 2002, 99, 4937-4940. (d) Jacobs, H. O.; Tao, A. R.; Schwartz, A.; Gracias, D. H.; Whitesides, G. M. Science 2002, 296, 323-325]; performing logical computations [(e) Rothemund, P. W. K. Proc. Natl. Acad. Sci. U.S.A. 2000, 97, 984-989]; and modeling materials [(f) Thalladi, V. R.; Schwartz, A.; Phend, J. N.; Hutchinson, J. W.; Whitesides, G. M. J. Am Chem. Soc. 2002, 124, 9912-9917].
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Schwartz, A.3
Gracias, D.H.4
Whitesides, G.M.5
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7
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0033971729
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The applications of mesoscale self-assembly include forming 3D microstructures [(a) Clark, T. D.; Tien, J.; Duffy, D. C.; Paul, K. E.; Whitesides, G. M. J. Am. Chem. Soc. 2001, 123, 7677-7682]; forming electrical networks [(b) Gracias, D. H.: Tien, J.; Breen, T. L.; Hsu, C.; Whitesides, G. M. Science 2000, 289, 1170-1172. (c) Boncheva, M.; Gracias, D. H.; Jacobs, H. O.; Whitesides, G. M. Proc. Natl. Acad. Sci. U.S.A. 2002, 99, 4937-4940. (d) Jacobs, H. O.; Tao, A. R.; Schwartz, A.; Gracias, D. H.; Whitesides, G. M. Science 2002, 296, 323-325]; performing logical computations [(e) Rothemund, P. W. K. Proc. Natl. Acad. Sci. U.S.A. 2000, 97, 984-989]; and modeling materials [(f) Thalladi, V. R.; Schwartz, A.; Phend, J. N.; Hutchinson, J. W.; Whitesides, G. M. J. Am Chem. Soc. 2002, 124, 9912-9917].
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Rothemund, P.W.K.1
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The applications of mesoscale self-assembly include forming 3D microstructures [(a) Clark, T. D.; Tien, J.; Duffy, D. C.; Paul, K. E.; Whitesides, G. M. J. Am. Chem. Soc. 2001, 123, 7677-7682]; forming electrical networks [(b) Gracias, D. H.: Tien, J.; Breen, T. L.; Hsu, C.; Whitesides, G. M. Science 2000, 289, 1170-1172. (c) Boncheva, M.; Gracias, D. H.; Jacobs, H. O.; Whitesides, G. M. Proc. Natl. Acad. Sci. U.S.A. 2002, 99, 4937-4940. (d) Jacobs, H. O.; Tao, A. R.; Schwartz, A.; Gracias, D. H.; Whitesides, G. M. Science 2002, 296, 323-325]; performing logical computations [(e) Rothemund, P. W. K. Proc. Natl. Acad. Sci. U.S.A. 2000, 97, 984-989]; and modeling materials [(f) Thalladi, V. R.; Schwartz, A.; Phend, J. N.; Hutchinson, J. W.; Whitesides, G. M. J. Am Chem. Soc. 2002, 124, 9912-9917].
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2O) in water. The objects were manually placed at the fluid-fluid interface in a Petri dish (diameter = 10 cm) and swirled at a frequency of 0.9 Hz on an orbital shaker to allow the self-assembly to occur. Each self-assembly experiment was carried out at least 5 times, and the expected aggregates were formed in all the experiments. The overall yield varied between 93 and 100%.
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