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Materials Science and Engineering: B

Volumn 88, Issue 1, 2002, Pages 103-106

Thermoelectric properties of p-type Te doped Bi0.5Sb1.5Te3 fabricated by powder extrusion

(5) Park, K a Seo, J H b Cho, D C b Choi, B H c Lee, C H b

a Sejong University (South Korea)

b Inha University (South Korea)

c Korea Institute of Ceramic Engineering and Technology (KICET) (South Korea)

Author keywords

Bi0.5Sb1.5Te3 compounds; Figure of merit; Powder extrusion; Thermoelectric properties

Indexed keywords

BENDING STRENGTH; ELECTRIC CONDUCTIVITY MEASUREMENT; GRAIN SIZE AND SHAPE; METAL EXTRUSION; POROSITY; SEEBECK EFFECT; SEMICONDUCTOR DOPING; TELLURIUM; THERMAL EFFECTS;

THERMOELECTRIC MATERIALS;

SEMICONDUCTING BISMUTH COMPOUNDS;

EID: 0037005661 PISSN: 09215107 EISSN: None Source Type: Journal
DOI: 10.1016/S0921-5107(01)00912-6 Document Type: Article

Times cited : (36)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.