Fabrication and thermoelectric properties of p-type Bi0.5Sb1.5Te3 compounds by ingot extrusion

Materials Research Bulletin

Volumn 35, Issue 13, 2000, Pages 2157-2163

  Seo, J ^a   Cho, D ^a   Park, K ^b   Lee, C ^a  

^a Inha University   (South Korea)

^b Sejong University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH COMPOUNDS; EXTRUSION; MICROSTRUCTURE; SOLID SOLUTIONS; THERMAL CONDUCTIVITY OF SOLIDS; THERMOELECTRICITY;

INGOT EXTRUSIONS;

INTERMETALLICS;

EID: 0034289615     PISSN: 00255408     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0025-5408(00)00425-6     Document Type: Article

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