Performance and reliability of a three-dimensional plastic moulded vertical multichip module (MCM-V)

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1995, Pages 656-663

  Barrett, J ^a   Cahill, C ^a   Compagno, T ^a   Flaherty, Martin O ^a   Hayes, T ^a   Lawton, W ^a   Donavan, J O ^a   Mathuna, C O ^a   McCarthy, G ^a   Slattery, O ^a   Waldron, F ^a   Vera, A Coella ^a   Masgrangeas, M ^a   Pipard, P ^a   Val, C ^a   Serthelon, I ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; PERFORMANCE; RELIABILITY;

THREE DIMENSIONAL PLASTIC MOULDED VERTICAL MULTICHIP MODULE;

MULTICHIP MODULES;

EID: 0029236304     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (20)