Thermal conductivity of intermetallic compounds with metallic bonding

Materials Transactions

Volumn 43, Issue 12, 2002, Pages 3167-3176

  Terada, Yoshihiro ^a   Ohkubo, Kenji ^a   Mohri, Tetsuo ^a   Suzuki, Tomoo ^b  

^a HOKKAIDO UNIVERSITY   (Japan)

^b KOCHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

B2; Intermetallic compound; L12; Microalloying; Thermal conductivity

Indexed keywords

ALLOYING; BONDING; COMPOSITION; CRYSTAL STRUCTURE; HIGH TEMPERATURE APPLICATIONS; SOLID SOLUTIONS; THERMAL CONDUCTIVITY;

METALLIC BONDING; MICROALLOYING; NORDHEIM RELATION; THERMAL CONDUCTION;

INTERMETALLICS;

EID: 0037001568     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.3167     Document Type: Article

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