Thermal conductivity of Ni3Al with ternary additions

Materials Science and Engineering: A

Volumn 311, Issue 1-2, 2001, Pages 232-235

  Terada, Yoshihiro ^a,c   Ohkubo, Kenji ^a   Mohri, Tetsuo ^a   Suzuki, Tomoo ^b  

^a HOKKAIDO UNIVERSITY   (Japan)

^b KOCHI UNIVERSITY OF TECHNOLOGY   (Japan)

^c TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Microalloying; Ni3Al; NiAl; Site preference; Thermal conductivity

Indexed keywords

NICKEL COMPOUNDS; SOLUBILITY; TERNARY SYSTEMS; THERMAL CONDUCTIVITY;

TERNARY PHASE DIAGRAMS;

MATERIALS SCIENCE;

ALUMINUM ALLOY; NICKEL ALLOY; THERMAL CONDUCTIVITY;

EID: 0035979442     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(01)01231-X     Document Type: Article

References (22)