Multi-band SAW front-end module considering impedance matching between FEM and direct-conversion RF-IC

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 2002, Pages 77-80

  Hikita, Mitsutaka ^a   Shibagaki, Nobuhiko ^a   Matsuura, Naoki ^a   Yokoyama, Kazuyuki ^a   Matsuda, Shigeki ^a   Hikino, Osamu ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); CELLULAR TELEPHONE SYSTEMS; DEMODULATION; FREQUENCY ALLOCATION; FREQUENCY RESPONSE; GLOBAL SYSTEM FOR MOBILE COMMUNICATIONS; IMPEDANCE MATCHING (ELECTRIC); INTEGRATED CIRCUITS; MIXER CIRCUITS; PERSONAL COMMUNICATION SYSTEMS;

DIRECT-CONVERSION DEMODULATION METHOD; LOW NOISE AMPLIFIERS; MULTI-BAND SURFACE ACOUSTIC WAVE FRONT-END MODULE;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 0036996073     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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