Flip-chip STW filters in the range of 0.4 to 5 GHZ

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 2002, Pages 11-18

  Yatsuda, H ^a   Iijima, H ^a   Yabe, K ^a   Iijima, O ^a  

^a JAPAN RADIO CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC RESONATORS; BONDING; CARBON INORGANIC COMPOUNDS; FLIP CHIP DEVICES; FREQUENCIES; GOLD; INTEGRATED CIRCUIT MANUFACTURE; OSCILLATORS (ELECTRONIC); QUARTZ; SEALING (FINISHING);

FLIP-CHIP SURFACE TRANSVERSE WAVE FILTERS; GOLD-TIN SOLDER SEALING; HIGH-FREQUENCY OSCILLATOR; THERMOSONIC FACE-DOWN-BONDING;

ACOUSTIC SURFACE WAVE FILTERS;

EID: 0036989155     PISSN: 10510117     EISSN: None     Source Type: Journal    
DOI: 10.1109/ULTSYM.2002.1193343     Document Type: Article

References (18)

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