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Volumn 716, Issue , 2002, Pages 401-406
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Modeling copper diffusion in silicon oxide, nitride, and carbide
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Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVATION ENERGY;
COMPUTER SIMULATION;
COPPER;
DIFFUSION IN SOLIDS;
NUMERICAL METHODS;
PROBABILITY DENSITY FUNCTION;
SILICON CARBIDE;
SILICON NITRIDE;
COPPER DIFFUSION;
SILICON OXIDE;
OXIDES;
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EID: 0036955157
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1557/proc-716-b8.4 Document Type: Conference Paper |
Times cited : (3)
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References (13)
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