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Volumn 716, Issue , 2002, Pages 401-406

Modeling copper diffusion in silicon oxide, nitride, and carbide

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPUTER SIMULATION; COPPER; DIFFUSION IN SOLIDS; NUMERICAL METHODS; PROBABILITY DENSITY FUNCTION; SILICON CARBIDE; SILICON NITRIDE;

EID: 0036955157     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-716-b8.4     Document Type: Conference Paper
Times cited : (3)

References (13)
  • 11
    • 0003998388 scopus 로고    scopus 로고
    • ed. D. R. Lide (CRC Press)
    • Handbook of Chemistry and Physics, ed. D. R. Lide (CRC Press, 1998-1999) p.5-13,
    • (1998) Handbook of Chemistry and Physics , pp. 5-13
  • 13
    • 0012486960 scopus 로고    scopus 로고
    • Univ. Washington, private communication
    • H. Jonsson and K. Tsmekhman, Univ. Washington, private communication.
    • Jonsson, H.1    Tsmekhman, K.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.