Interfacial adhesion study of porous low-k dielectrics to CVD barrier layers

Materials Research Society Symposium - Proceedings

Volumn 716, Issue , 2002, Pages 613-618

  Lee, J A ^a   Wetzel, Jeffrey T ^c   Merrill, Caroline ^b   Ho, Paul S ^b  

^a SEMATECH   (United States)

^b The University of Texas at Austin   (United States)

^c NONE

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AUGER ELECTRON SPECTROSCOPY; CHEMICAL VAPOR DEPOSITION; ELASTIC MODULI; FRACTURE; HARDNESS; INTERFACES (MATERIALS); PERMITTIVITY; POROSITY; POROUS MATERIALS; SCANNING ELECTRON MICROSCOPY; SURFACE PROPERTIES;

ADHESION ENERGY; BARRIER LAYERS; FRACTURE ENERGY;

DIELECTRIC MATERIALS;

EID: 0036955126     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-716-b12.12     Document Type: Conference Paper

References (5)

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5. G. Fernlund and J. K. Spelt, "Mixed-mode Fracture Characterization of Adhesive Joints", Composites Science and Technology, Vol. 50, 1994, pp. 441-449.