Texture analysis of copper bonding wire

Materials Science Forum

Volumn 408-412, Issue I, 2002, Pages 803-808

  Baeck, Suk Min ^a   Park, Kwang Kyun ^a   Ha, Hunphil ^c   Oh, Youngjoo ^c   Park, Yongjin ^b   Moon, Jung Tak ^b   Lee, Jin ^b   Oh, Kyu Hwan ^a  

^a Seoul National University   (South Korea)

^b MK Electron Co Ltd   (South Korea)

^c Korea Institute of Science and Technology   (South Korea)

Author keywords

Copper Bonding Wire; EBSD; Recrystallization; Texture

Indexed keywords

ANNEALING; COPPER; ELECTROMAGNETIC WAVE BACKSCATTERING; GRAIN SIZE AND SHAPE; INTEGRATED CIRCUITS; MICROSTRUCTURE; OPTIMIZATION; RECRYSTALLIZATION (METALLURGY); TEXTURES;

ELECTRON BACKSCATTERED DIFFRACTION (EBSD);

ELECTRIC WIRE;

EID: 0036947035     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.408-412.803     Document Type: Conference Paper

References (5)

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2. C.S. Barrett and T.B. Massalski, Structure of Metals: Crystallographic Methods, Principle, and Data, third edition, McGraw-Hill Inc., 1946.
3. M. Hatherly and W.B. Hutchinson, An Introduction to Textures in Metals, Institute of Metals, London, 1979.
4. H. Yamamoto and N. Inakasu, Journal J.C.B.R Accociation, 1974, 13, pp. 133.
5. Peter N. Kalu, Luiz Brandao, Francisco Ortiz, Okechukwu Egungwu and Funmi Ige, Scripta Materials, 1998, vol. 38, no. 12, pp. 1755-1761.