300 mm wafer fabrication line simulation model

Winter Simulation Conference Proceedings

Volumn 2, Issue , 2002, Pages 1365-1368

  Shikalgar, Sameer T ^a   Fronckowiak, David ^a   MacNair, Edward A ^b  

^a IBM MICROELECTRONICS   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUFFER STORAGE; COMPUTER SIMULATION; CONTAMINATION; LOADING; SCHEDULING; SEMICONDUCTOR DEVICE MANUFACTURE; STRATEGIC PLANNING;

PARTICULATE CONTAMINATION;

SILICON WAFERS;

EID: 0036932338     PISSN: 02750708     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Campbell, P., and G. Laitinen. 1997. Overhead Intrabay Automation and Microstocking - a virtual Fab case study. In Proceedings of the IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, 368-372. Cambridge, MA.
2. Campbell, P., and M. Norman. 1998. Microstocking and Fab Throughput. In Proceedings of the AutoSimulations '98 Symposium, 101-106. Bountiful, UT.
3. Campbell, P., and M. Norman. 1999. Simulation Used To Model And Test Improvements In 300 Mm Fab Throughput. Available online via 〈http://www.semicondutoronline.com〉.
4. Norman, M., and J. Barksdale. 1999. Integrated Manufacturing and Material Handling Simulation Modeling. In Proceedings of the SIMULATION Solutions '99 Conference. Mesa, AZ.