The effect of aging on tungsten filament surface kinetics in hot-wire chemical vapor deposition of silicon

Materials Research Society Symposium - Proceedings

Volumn 715, Issue , 2002, Pages 165-170

  Holt, Jason K ^a   Swiatek, Maribeth ^a   Goodwin, David G ^a   Atwater, Harry A ^a  

^a California Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; CHEMICAL VAPOR DEPOSITION; DESORPTION; ELECTRONIC PROPERTIES; EVAPORATION; FILM GROWTH; FREE RADICALS; MASS SPECTROMETRY; REACTION KINETICS; TEMPERATURE MEASUREMENT; TUNGSTEN;

HOT WIRE CHEMICAL VAPOR DEPOSITION; RADICAL CHEMISTRY; RADICAL DESORPTION KINETICS; TUNGSTEN FILAMENT SURFACE KINETICS;

SILICON;

EID: 0036928282     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: 10.1557/proc-715-a23.3     Document Type: Article

References (13)

1. Y. Nozaki, K. Kongo, T. Miyazaki, M. Kitazoe, K. Horii, H. Umemoto, A. Masuda, and H. Matsumura, J. Appl. Phys. 88, 5437 (2000).
2. S. Tange, K. Inoue, K. Tonokura, and M. Koshi., Thin Solid Films, 395 (1-2), 42-46 (2001).
3. H. Duan, G. Zaharias, and S. Bent, Appl. Phys. Lett. 78, 1784 (2001).
4. J. Holt, M. Swiatek, D. Goodwin, and H. Atwater, Mat. Res. Soc. Symp. Proc., San Francisco, 2001, Vol. 664.
5. J. Doyle, R. Robertson, G. Lin, M. He, and A. Gallagher, J. Appl. Phys. 64, 3215 (1988).
6. A. Mahan, A. Mason, B. Nelson, and A. Gallagher, Mat. Res. Soc. Symp. Proc., San Francisco, 2000, Vol. 609.
7. H. Matsumura, A. Masuda, and A. Izumi, Mat. Res. Soc. Symp. Proc., San Francisco, 1999, Vol. 557.
8. J.H. Purnell and R. Walsh, Chem. Phys. Lett. 110 (1984).
9. Thermochemical and Physical Properties (TAPP), v.2.1, ES Microware (1991).
10. S. Kharatyan and H. Chatilyan, J. Prikladnoy Khimii Armenii (1-2) 22-30 (1999).
11. G. Ehrlich, Adv. Catal. Rel. Subj. 14, 271-273 (1963).
12. J. Margrave, The Characterization of High-Temperature Vapors, John Wiley & Sons, Inc. (New York) 1967.
13. H. Yang, M. Asplund, K. Kotz, M. Wilkens, H. Frei, and C. Harris, J. Amer. Chem. Soc. 120, 10154 (1998).