-
1
-
-
0034481619
-
Low cost packaging techniques for active waveguide devices
-
M. Shaw, M. Marazzi, and S. Bonino, "Low cost packaging techniques for active waveguide devices," in Proc. 50th Electron. Comp. Technol. Conf., 2000, pp. 742-748.
-
(2000)
Proc. 50th Electron. Comp. Technol. Conf.
, pp. 742-748
-
-
Shaw, M.1
Marazzi, M.2
Bonino, S.3
-
2
-
-
0034479498
-
Epoxy adhesives for optical element attachment in planar passive optical componenets
-
J. Liu, B. Anderson, E. Bergmann, and S. Fairchild, "Epoxy adhesives for optical element attachment in planar passive optical componenets," in Proc. 50th Electron. Comp. Technol. Conf., 2000, pp. 975-980.
-
(2000)
Proc. 50th Electron. Comp. Technol. Conf.
, pp. 975-980
-
-
Liu, J.1
Anderson, B.2
Bergmann, E.3
Fairchild, S.4
-
3
-
-
0031644353
-
Reliability study of an epoxy-bonded laser-to-fiber assembly
-
D. Wu and Y. Lee, "Reliability study of an epoxy-bonded laser-to-fiber assembly," in Proc 48th Electron. Comp. Technol. Conf., 1998, pp. 1186-1191.
-
(1998)
Proc 48th Electron. Comp. Technol. Conf.
, pp. 1186-1191
-
-
Wu, D.1
Lee, Y.2
-
4
-
-
0025521013
-
Curing shrinkage effects of UV-curable materials on fiber loss characteristics
-
Nov.
-
T. Kokubun and Y. Katsuyama, "Curing shrinkage effects of UV-curable materials on fiber loss characteristics," J. Lightwave Technol., vol. 8, pp. 1654-1658, Nov. 1990.
-
(1990)
J. Lightwave Technol.
, vol.8
, pp. 1654-1658
-
-
Kokubun, T.1
Katsuyama, Y.2
-
5
-
-
0000290060
-
Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices: Problem in device packaging
-
June
-
H. Nagata, M. Shiroishi, Y. Miyama, N. Mitsugi, and N. Miyamoto, "Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices: problem in device packaging," Optical Fiber Technol.: Mater., Devices Syst., vol. 1, pp. 283-288, June 1995.
-
(1995)
Optical Fiber Technol.: Mater., Devices Syst.
, vol.1
, pp. 283-288
-
-
Nagata, H.1
Shiroishi, M.2
Miyama, Y.3
Mitsugi, N.4
Miyamoto, N.5
-
6
-
-
0032606341
-
General formula for coupling-loss characterization of single-mode fiber collimators by use of gradient-index rod lenses
-
May
-
S. Yuan and N. A. Riza, "General formula for coupling-loss characterization of single-mode fiber collimators by use of gradient-index rod lenses," Appl. Opt., vol. 38, pp. 3214-3222, May 1999.
-
(1999)
Appl. Opt.
, vol.38
, pp. 3214-3222
-
-
Yuan, S.1
Riza, N.A.2
-
7
-
-
0001631712
-
Coupling characteristics analysis of single-mode and multimode optical-fiber connectors using gradient-index-rod lenses
-
Sept.
-
T. Sakamoto, "Coupling characteristics analysis of single-mode and multimode optical-fiber connectors using gradient-index-rod lenses," Appl. Opt., vol. 31, pp. 5184-5190, Sept. 1992.
-
(1992)
Appl. Opt.
, vol.31
, pp. 5184-5190
-
-
Sakamoto, T.1
-
8
-
-
0019008418
-
Application of GRIN-rod lenses in optical fiber communication systems
-
Apr.
-
W. J. Tomlinson, "Application of GRIN-rod lenses in optical fiber communication systems," Appl. Opt., vol. 19, pp. 1127-1138, Apr. 1980.
-
(1980)
Appl. Opt.
, vol.19
, pp. 1127-1138
-
-
Tomlinson, W.J.1
-
9
-
-
0032665219
-
Collective microoptics on fiber ribbon for optical interconnecting devices
-
May
-
P. Chanclou et al., "Collective microoptics on fiber ribbon for optical interconnecting devices," J. Lightwave Technol., vol. 17, pp. 924-928, May 1999.
-
(1999)
J. Lightwave Technol.
, vol.17
, pp. 924-928
-
-
Chanclou, P.1
-
10
-
-
0000835270
-
Optical interconnects at the chip and board level: Challenges and solutions
-
June
-
D. V. Plant and A. G. Kirk, "Optical interconnects at the chip and board level: Challenges and solutions," Proc. IEEE, vol. 88, pp. 806-818, June 2000.
-
(2000)
Proc. IEEE
, vol.88
, pp. 806-818
-
-
Plant, D.V.1
Kirk, A.G.2
-
11
-
-
0034240695
-
Collimating of diverging laser diode beam using graded-index optical fiber
-
Aug.
-
S. H. Wang et al., "Collimating of diverging laser diode beam using graded-index optical fiber," Opt. Lasers Eng., vol. 34, pp. 121-127, Aug. 2000.
-
(2000)
Opt. Lasers Eng.
, vol.34
, pp. 121-127
-
-
Wang, S.H.1
-
12
-
-
0034480263
-
Alignment considerations in packaging array-based optical interconnects and processors
-
A. K. Ghosh, "Alignment considerations in packaging array-based optical interconnects and processors," in Proc 50th Electron. Comp. Technol. Conf., 2000, pp. 1493-1497.
-
(2000)
Proc 50th Electron. Comp. Technol. Conf.
, pp. 1493-1497
-
-
Ghosh, A.K.1
-
13
-
-
0034322365
-
Fault-tolerant variable fiberoptic attenuator using three dimensional beam spoiling
-
Nov.
-
N. A. Riza and S. Sumriddetchkajorn, "Fault-tolerant variable fiberoptic attenuator using three dimensional beam spoiling," Opt. Commun., vol. 185, pp. 103-108, Nov. 2000.
-
(2000)
Opt. Commun.
, vol.185
, pp. 103-108
-
-
Riza, N.A.1
Sumriddetchkajorn, S.2
-
15
-
-
0009583435
-
A novel free-space fiber array to collimator array alignment design
-
to be published
-
S. K. Mondal, R. Zhang, and F. G. Shi, "A novel free-space fiber array to collimator array alignment design," Opt. Commun., to be published.
-
Opt. Commun.
-
-
Mondal, S.K.1
Zhang, R.2
Shi, F.G.3
-
16
-
-
0036076351
-
Packaging of fiber collimators
-
Jan.
-
H. Zhou, Z. Tang, Y. Lin, W. Liu, S. Mondal, and F. G. Shi, "Packaging of fiber collimators," Adv. Packag., vol. 11, pp. 25-28, Jan. 2002.
-
(2002)
Adv. Packag.
, vol.11
, pp. 25-28
-
-
Zhou, H.1
Tang, Z.2
Lin, Y.3
Liu, W.4
Mondal, S.5
Shi, F.G.6
-
17
-
-
0036287169
-
Assembling of fiber collimators for photonic devices
-
H. Zhou, Z. Tang, S. Mondal, F. G. Shi, N. Zhang, A. Burkhart, and M. Edwards, "Assembling of fiber collimators for photonic devices," in Proc. 52nd Electron. Comp. Technol. Conf., 2002, pp. 821-827.
-
(2002)
Proc. 52nd Electron. Comp. Technol. Conf.
, pp. 821-827
-
-
Zhou, H.1
Tang, Z.2
Mondal, S.3
Shi, F.G.4
Zhang, N.5
Burkhart, A.6
Edwards, M.7
-
18
-
-
0036287420
-
Adhesive joint design for high yield & low cost assembly of fiberoptic devices
-
Y. Lin, W. Liu, and F. G. Shi, "Adhesive joint design for high yield & low cost assembly of fiberoptic devices," in Proc. 52nd Electron. Comp. Technol. Conf., 2002, pp. 662-666.
-
(2002)
Proc. 52nd Electron. Comp. Technol. Conf.
, pp. 662-666
-
-
Lin, Y.1
Liu, W.2
Shi, F.G.3
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