Adhesive joint design for high yield & low cost assembly of fiberoptic devices

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 662-666

  Lin, Yaomin ^a   Liu, Wenning ^a   Shi, Frank G ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LENS ARRAYS; PHOTONIC DEVICES;

ADHESIVE JOINTS; ASSEMBLY; CRACK INITIATION; CURING; DEFORMATION; ELASTIC MODULI; ELECTRONICS PACKAGING; OPTICAL COLLIMATORS; SHRINKAGE;

FIBER OPTICS;

EID: 0036287420     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008167     Document Type: Conference Paper

References (5)

1. Adhesives for optical devices
2. Packaging of fiber collimators - A novel automation process for photonic devices
3. Stress buildup in ultraviolet-cured coatings: Sample thickness dependence