Copper device editing: Strategy for focused ion beam milling of copper

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 20, Issue 6, 2002, Pages 2682-2685

  Casey, J David ^a   Phaneuf, Michael ^b   Chandler, Clive ^a   Megorden, Michael ^a   Noll, Kathryn E ^a   Schuman, Richard ^a   Gannon, Thomas J ^a   Krechmer, Alex ^a   Monforte, David ^a   Antoniou, Nicholas ^a   Bassom, Neil ^a   Li, Jian ^b   Carleson, Peter ^a   Huynh, Chuong ^a  

^a Thermo Fisher Scientific   (United States)

^b Fibics Incorporated   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL ORIENTATION; ELECTRIC CONDUCTIVITY OF SOLIDS; ETCHING; FAILURE ANALYSIS; GALLIUM; GASES; GRAIN SIZE AND SHAPE; OPTICAL INTERCONNECTS; SEMICONDUCTOR DEVICES; SILICA; SINGLE CRYSTALS;

COPPER DEVICE; COPPER HALIDES; FOCUSED ION BEAM; GAS ASSISTED ETCHING; HEAVY ATOMS;

ION BEAMS;

EID: 0036874415     PISSN: 0734211X     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1521736     Document Type: Article

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