Particle adhesion and removal mechanisms in post-CMP cleaning processes

IEEE Transactions on Semiconductor Manufacturing

Volumn 15, Issue 4, 2002, Pages 374-382

  Busnaina, Ahmed A ^a   Lin, Hong ^b   Moumen, Naim ^b   Feng, Jiang Wei ^c   Taylor, Jack ^b  

^a NORTHEASTERN UNIVERSITY   (United States)

^b IBM MICROELECTRONICS   (United States)

^c Corning Inc ^*  (United States)

Author keywords

Adhesion induced deformation; Contact (brush) cleaning; Noncontact cleaning; Particle adhesion; Particle removal; Post CMP cleaning

Indexed keywords

ADHESION; AGING OF MATERIALS; DEFORMATION; HYDROGEN BONDS; PHOTOLITHOGRAPHY;

PARTICLE ADHESION;

CHEMICAL MECHANICAL POLISHING;

EID: 0036868683     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2002.804872     Document Type: Conference Paper

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