Assessing the reliability of plated vias

Printed Circuit Fabrication

Volumn 25, Issue 11, 2002, Pages 30-37

  Ahmad, Mudasir ^a   Teng, Sue ^b   Mason, H U ^b   Brillhart, Mark ^b  

^a CISCO SYSTEMS   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ASSEMBLY; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; INTERCONNECTION NETWORKS; QUALITY CONTROL; RELIABILITY; SOLDERED JOINTS; THERMAL CYCLING; THERMAL EXPANSION; THERMAL STRESS;

THERMOMECHANICAL STRESSES;

PRINTED CIRCUIT BOARDS;

EID: 0036854160     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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2. B. Mirman, "Mathematical Model of a Plated-Through Hole Under a Load Induced by Thermal Mismatch," IEEE Transactions CHMT, vol. 11, no. 4, p. 506, Dec. 1988.
3. S. Rominger, "Predicting Reliability of Printed Wiring Boards with Variable Parameters using Finite Element Modeling," Circuitree, p. 36, May 2000.
4. R. Darveaux, K. Banerji, A. Mawer, and G. Dody, "Reliability of Plastic Ball Grid Array Assembly," Ball Grid Array Technology, John Lau, editor, McGraw-Hill, pp. 379-442, 1995.
5. J.H. Lau and Y.H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, 1997.
6. R.R. Tummala, E.J. Rymaszewski, and A.G. Klopfenstein, Microelectronics Packaging Handbook, Chapman and Hall, 1997.
7. K. Ramakrishna and B.G. Sammakia, "Analysis of Strains in Plated Through Holes During Current Induced Thermal Cycling of a Printed Wiring Board" ASME International Mechanical Engineering Congress & Exposition Proceedings, November 1995.
8. IPC-TR-579, "Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards" 1988.
9. IPC-TM-650, Test Methods Manual, method 2.6.26.
10. R. Munikoti and R. Dhar, "A New Power Cycling Technique for Accelerated Reliability Evaluation of Plated-Through-Holes and interconnects in PCBs," Proceedings, 40th IEEE Electronic Components and Technology Conference, 1990, p. 426, 1990.
11. D. Goyal, H. Azimi, K Poh, and M. Lii, "Reliability of High Aspect Ratio Plated Through Holes (PTH) for Advanced Printed Circuit Board (PCB) Packages" IEEE International Reliability Physics Proceedings, p. 129, 1997.
12. H.D. Merchant, M.G. Minor, and Y.L.Liu, "Mechanical Fatigue of Thin Copper Foil," Journal of Electronic Materials, vol. 28, no. 9, p. 998,1999.