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Volumn 49, Issue 10, 2002, Pages 681-685

Voltage shift in plastic-packaged bandgap references

Author keywords

[No Author keywords available]

Indexed keywords

BAND STRUCTURE; CARRIER CONCENTRATION; ELECTRIC POTENTIAL; ELECTRON MOBILITY; ERROR ANALYSIS; PLASTICS; QUANTUM THEORY; STRESS ANALYSIS;

EID: 0036826077     PISSN: 10577130     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCSII.2002.806734     Document Type: Article
Times cited : (24)

References (12)
  • 3
    • 0031276897 scopus 로고    scopus 로고
    • Stress-induced parametric shift in plastic packaged devices
    • Nov
    • H. Ali, "Stress-induced parametric shift in plastic packaged devices," IEEE Trans. Comp., Packag., Manufact. Technol. C, vol. CPMTC-20, pp. 458-462, Nov. 1997.
    • (1997) IEEE Trans. Comp., Packag., Manufact. Technol. C , vol.CPMTC-20 , pp. 458-462
    • Ali, H.1
  • 5
    • 0025556206 scopus 로고
    • Parametric shifts in devices: Role of packaging variables and some novel solutions
    • R. Pendse and D. Jenning, "Parametric shifts in devices: Role of packaging variables and some novel solutions," in Proc. 40th Electronic Components and Technology Conf., 1990, pp. 322-326.
    • (1990) Proc. 40th Electronic Components and Technology Conf. , pp. 322-326
    • Pendse, R.1    Jenning, D.2
  • 7
    • 0022313453 scopus 로고
    • Stress-induced deformation of aluminum metallization in plastic molded semiconductor devices
    • Dec
    • R. E. Thomas, "Stress-induced deformation of aluminum metallization in plastic molded semiconductor devices," IEEE Trans. Comp. Hybrids, Manufact. Technol., vol. CHMT-8, pp. 427-434, Dec. 1985.
    • (1985) IEEE Trans. Comp. Hybrids, Manufact. Technol. , vol.CHMT-8 , pp. 427-434
    • Thomas, R.E.1
  • 8
    • 0020278266 scopus 로고
    • Piezoresistivity effects in plastic-encapsulated integrated circuits
    • Dec
    • K. M. Schlesier, S. A. Keneman, and R. T. Mooney, "Piezoresistivity effects in plastic-encapsulated integrated circuits," RCA Rev., vol. 43, pp. 590-607, Dec. 1982.
    • (1982) RCA Rev. , vol.43 , pp. 590-607
    • Schlesier, K.M.1    Keneman, S.A.2    Mooney, R.T.3
  • 10
    • 0000052811 scopus 로고
    • Effects of mechanical stress on p-n junction device characteristics
    • J. J. Wortman, J. R. Hauser, and R. M. Burger, "Effects of mechanical stress on p-n junction device characteristics," J. Appl. Phys., vol. 35, pp. 2122-2130, 1964.
    • (1964) J. Appl. Phys. , vol.35 , pp. 2122-2130
    • Wortman, J.J.1    Hauser, J.R.2    Burger, R.M.3
  • 12
    • 0027167416 scopus 로고
    • On-chip piezoresistive stress measurement and 3D finite element simulations of plastic DIL 40 packages using different materials
    • H. C. J. M. van Gestel, L. van Gemert, and E. Bagerman, "On-chip piezoresistive stress measurement and 3D finite element simulations of plastic DIL 40 packages using different materials," in Proc. 44th Electronic Components and Technology Conf., 1993, pp. 124-133.
    • (1993) Proc. 44th Electronic Components and Technology Conf. , pp. 124-133
    • Van Gestel, H.C.J.M.1    Van Gemert, L.2    Bagerman, E.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.