-
3
-
-
0031276897
-
Stress-induced parametric shift in plastic packaged devices
-
Nov
-
H. Ali, "Stress-induced parametric shift in plastic packaged devices," IEEE Trans. Comp., Packag., Manufact. Technol. C, vol. CPMTC-20, pp. 458-462, Nov. 1997.
-
(1997)
IEEE Trans. Comp., Packag., Manufact. Technol. C
, vol.CPMTC-20
, pp. 458-462
-
-
Ali, H.1
-
4
-
-
0027251233
-
Stress related offset voltage shift in a precision operational amplifier
-
S. Gee, T. Doan, and K. Gilbert, "Stress related offset voltage shift in a precision operational amplifier," in Proc. 43rd Electronic Components and Technology Conf., 1993, pp. 755-764.
-
(1993)
Proc. 43rd Electronic Components and Technology Conf.
, pp. 755-764
-
-
Gee, S.1
Doan, T.2
Gilbert, K.3
-
5
-
-
0025556206
-
Parametric shifts in devices: Role of packaging variables and some novel solutions
-
R. Pendse and D. Jenning, "Parametric shifts in devices: Role of packaging variables and some novel solutions," in Proc. 40th Electronic Components and Technology Conf., 1990, pp. 322-326.
-
(1990)
Proc. 40th Electronic Components and Technology Conf.
, pp. 322-326
-
-
Pendse, R.1
Jenning, D.2
-
6
-
-
0033907557
-
CMOS stress sensors on (100) silicon
-
Jan
-
R. C. Jaeger, J. C. Suhling, R. Ramani, A. T. Bradley, and J. Xu, "CMOS stress sensors on (100) silicon," IEEE J. Solid-State Circuits, vol. 35, pp. 85-95, Jan. 2000.
-
(2000)
IEEE J. Solid-State Circuits
, vol.35
, pp. 85-95
-
-
Jaeger, R.C.1
Suhling, J.C.2
Ramani, R.3
Bradley, A.T.4
Xu, J.5
-
7
-
-
0022313453
-
Stress-induced deformation of aluminum metallization in plastic molded semiconductor devices
-
Dec
-
R. E. Thomas, "Stress-induced deformation of aluminum metallization in plastic molded semiconductor devices," IEEE Trans. Comp. Hybrids, Manufact. Technol., vol. CHMT-8, pp. 427-434, Dec. 1985.
-
(1985)
IEEE Trans. Comp. Hybrids, Manufact. Technol.
, vol.CHMT-8
, pp. 427-434
-
-
Thomas, R.E.1
-
8
-
-
0020278266
-
Piezoresistivity effects in plastic-encapsulated integrated circuits
-
Dec
-
K. M. Schlesier, S. A. Keneman, and R. T. Mooney, "Piezoresistivity effects in plastic-encapsulated integrated circuits," RCA Rev., vol. 43, pp. 590-607, Dec. 1982.
-
(1982)
RCA Rev.
, vol.43
, pp. 590-607
-
-
Schlesier, K.M.1
Keneman, S.A.2
Mooney, R.T.3
-
9
-
-
0013211803
-
New filler-induced failure mechanism in plastic encapsulated VLSI dynamic MOS memories
-
H. Matsumoto, M. Yamada, J. Fukushima, T. Kondo, N. Kotani, and M. Tosa, "New filler-induced failure mechanism in plastic encapsulated VLSI dynamic MOS memories," in Proc. IEEE Int. Reliability Physics Symp., 1981, pp. 180-183.
-
(1981)
Proc. IEEE Int. Reliability Physics Symp.
, pp. 180-183
-
-
Matsumoto, H.1
Yamada, M.2
Fukushima, J.3
Kondo, T.4
Kotani, N.5
Tosa, M.6
-
10
-
-
0000052811
-
Effects of mechanical stress on p-n junction device characteristics
-
J. J. Wortman, J. R. Hauser, and R. M. Burger, "Effects of mechanical stress on p-n junction device characteristics," J. Appl. Phys., vol. 35, pp. 2122-2130, 1964.
-
(1964)
J. Appl. Phys.
, vol.35
, pp. 2122-2130
-
-
Wortman, J.J.1
Hauser, J.R.2
Burger, R.M.3
-
12
-
-
0027167416
-
On-chip piezoresistive stress measurement and 3D finite element simulations of plastic DIL 40 packages using different materials
-
H. C. J. M. van Gestel, L. van Gemert, and E. Bagerman, "On-chip piezoresistive stress measurement and 3D finite element simulations of plastic DIL 40 packages using different materials," in Proc. 44th Electronic Components and Technology Conf., 1993, pp. 124-133.
-
(1993)
Proc. 44th Electronic Components and Technology Conf.
, pp. 124-133
-
-
Van Gestel, H.C.J.M.1
Van Gemert, L.2
Bagerman, E.3
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