Effect of copper seed aging on electroplating-induced defects in copper interconnects

Journal of Electronic Materials

Volumn 31, Issue , 2002, Pages 1047-1051

  Contestable Gilkes, Daniele ^a   Ramappa, Deepak ^a   Oh, Minseok ^a   Merchant, Sailesh M ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

Copper thin films; Defects; Electroplating; Interconnects; Seed aging; Surface treatment; Wetting behavior

Indexed keywords

AGING OF MATERIALS; COPPER PLATING; ELECTROLYTES; ELECTROPLATING; HYDROGEN; INTERCONNECTION NETWORKS; OXIDATION; SURFACE TREATMENT; THIN FILMS; WETTING;

ELECTROPLATING-INDUCED DEFECTS;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0036810332     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0041-7     Document Type: Article

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