Eliminating process-related defects during the fabrication of copper interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 85-89

  Oh, Minseok ^a   Ramappa, Deepak A ^a   Contestable Gilkes, Daniele ^a   Merchant, Sailesh M ^a   Jones, Douglas E ^a   Subramanian, Karthikeyan ^a   Lytle, Steve ^a   Oladeji, Isaiah ^a   Seet, Chim Seng ^a   Li, He Ming ^a  

^a AGERE SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COPPER; COSTS; DEFECTS; ELECTROPLATING; PHOTOLITHOGRAPHY;

COPPER INTERCONNECTS;

DIELECTRIC MATERIALS;

EID: 0035555359     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)