Development of low loss organic-micromachined interconnects on silicon at microwave frequencies

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 3, 2002, Pages 506-510

  Newlin, Daniel P ^a   Pham, Anh Vu H ^b   Harriss, James E ^a  

^a South   (United States)

^b Davis   (United States)

Author keywords

Interconnects; Micromachining; Microwave; Organic; Packaging; UV LIGA

Indexed keywords

ATTENUATION; ELECTRONICS PACKAGING; ELECTROPLATING; LITHOGRAPHY; MICROWAVES; MILLIMETER WAVES; MOLDING; SILICON; SPIN COATING; WAVEGUIDES;

ORGANIC-MICROMACHINED INTERCONNECTS;

MICROMACHINING;

EID: 0036767945     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.803654     Document Type: Conference Paper

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