Interfacial degradation of epoxy coated silicon nitride

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 3, 2002, Pages 470-477

  Park, Jongwoo ^a   Harlow, D Gary ^b  

^a Princeton Optronics   (United States)

^b Lehigh University   (United States)

Author keywords

Acceleration test; Adhesion; Blister; Electron microscopy; Etch; Silane; Silicon nitride; Weibull cumulative distribution function; X ray photoelectron spectrometry

Indexed keywords

ADHESION; ATMOSPHERIC HUMIDITY; CHEMICAL VAPOR DEPOSITION; COATINGS; CONTACT ANGLE; CRACKS; DEGRADATION; ETCHING; NUCLEATION; OPTICAL MICROSCOPY; OXYGEN; PASSIVATION; SILICON WAFERS; STRESS ANALYSIS; WEIBULL DISTRIBUTION; X RAY PHOTOELECTRON SPECTROSCOPY;

CUMULATIVE DISTRIBUTION FUNCTION (CDF);

SILICON NITRIDE;

EID: 0036767638     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.803651     Document Type: Conference Paper

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