Modeling 3D effects of substrate topography on step coverage and film morphology of thin metal films

Thin Solid Films

Volumn 415, Issue 1-2, 2002, Pages 32-45

  Smy, T ^a   Dew, S K ^b   Joshi, R V ^c  

^a CARLETON UNIVERSITY   (Canada)

^b UNIVERSITY OF ALBERTA   (Canada)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Sputtering; Structural properties

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTROPLATING; FILM GROWTH; METALLIC FILMS; MICROSTRUCTURE; OPTIMIZATION; REFRACTORY METALS; SPUTTER DEPOSITION;

INTEGRATED CIRCUIT TOPOGRAPHY;

THIN FILMS;

EID: 0036670778     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)00502-3     Document Type: Article

References (7)