Future IC fabrication rests on solutions to circuit and device scaling issues

Solid State Technology

Volumn 45, Issue 7, 2002, Pages 71-72+74+76

  Zeitzoff, Peter M ^a   Murto, Robert W ^a   Huff, Howard R ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; DIELECTRIC MATERIALS; LEAKAGE CURRENTS; LOGIC CIRCUITS; PROCESS CONTROL; STATISTICAL METHODS; THRESHOLD VOLTAGE; TRANSISTORS;

FRONT END PROCESS SCALING; LOW POWER LOGIC; POWER SUPPLY VOLTAGE;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0036650673     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)