Design Constraints for the Use of Insulated Metal Substrates®

Microelectronics International: An International Journal

Volumn 10, Issue 1, 1993, Pages 58-60

  Fick, H ^a  

^a The Bergquist Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84948220053     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/eb044491     Document Type: Review

References (3)

1. Nelson, J. K., ‘Engineering Dielectrics’, edited by Bartnikas and Eichhorn, ASTM STP 783, Vol. IIA (1983).
2. ‘PowerSupply InsuIationandIEC950/UL 1950’, PCIM92, Nuremberg.
3. ‘Agency Acceptance and Safety Insulation’, High Frequency Power Conversion 92.