Lead-free packaging: Investigating pure tin as an alternative finish

Advanced Packaging

Volumn 10, Issue 4, 2001, Pages 29-38

  Bidin, Rahamat ^b   Tacapulot, Rosemarie ^b   Lao, Carl Nichelle D ^a   Mañalac, Rodel ^b  

^a ST Assembly Test Services Ltd   (Singapore)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0009704496     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)

1. AC Tan, Tin and Solder Plating in the Semiconductor Industry, Chapman & Hall, 1993.
2. Manfred Jordan, The Electrodeposition of Tin and its Alloys, Eugen G. Leuze Publishers, Germany, 1995.
3. Manolo G. Mena, Materials Science for Semiconductor Engineers, College of Engineering, University of the Philippines, 1996.
4. Yamaguchi, et al, Non-Halogen/Antimony Flame Retardant Systems for High End IC Package, Electronic Components and Technology Conference, IEEE, 1997.