A study of moisture diffusion in plastic packaging

Journal of Electronic Materials

Volumn 31, Issue 5, 2002, Pages 449-455

  Cai, Xia ^a   Huang, Weidong ^a   Xu, Bulu ^a   Kaltenpoth, Gisela ^b   Cheng, Zhaonian ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b UNIVERSITY OF HEIDELBERG   (Germany)

Author keywords

Delamination; Liquid water; Moisture diffusion; Plastic material; Popcorn

Indexed keywords

ABSORPTION; ADHESION; ATMOSPHERIC HUMIDITY; DELAMINATION; DESORPTION; DIFFUSION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; HYDROGEN BONDS; INTERFACES (MATERIALS); PACKAGING; SATURATION (MATERIALS COMPOSITION); VAPOR PRESSURE; WATER;

C-MODE SCANNING ACOUSTIC MICROSCOPY (C-SAM); PLASTIC PACKAGING;

PLASTICS;

PACKAGING; PLASTICS;

EID: 0036575616     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0099-2     Document Type: Article

References (17)