Electrical bottom side contacting of electromechanical LIGA-structures by vias and screen printing

Microsystem Technologies

Volumn 8, Issue 2-3, 2002, Pages 113-115

  Ruzzu, A ^a   Fromhein, O ^a   Haller, D ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRODES; INTEGRATED CIRCUITS; MICROMACHINING; MULTILAYERS; PRINTED CIRCUIT BOARDS; SCREEN PRINTING; SILICON; SUBSTRATES; THICK FILMS;

SILICON SURFACE MICROMACHINING;

ELECTRIC CONTACTS;

EID: 0036575571     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-001-0137-7     Document Type: Conference Paper

References (2)

1. Fabrication of capacitive acceleration sensors by the LIGA-technique
2. Optical 2 × 2 switch matrix with electromechanical micromotors