Blind via hole in multi-layer AFRP printed wiring boards by build-up process (Quality of hole drilled by small power laser)

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 45, Issue 2, 2002, Pages 282-289

  Hirogaki, Toshiki ^a   Nakagawa, Heisaburo ^a   Aoyama, Eiichi ^b   Katayama, Tsutao ^b   Inoue, Hisahiro ^c  

^a UNIVERSITY OF SHIGA PREFECTURE   (Japan)

^b DOSHISHA UNIVERSITY   (Japan)

^c AICHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

AFRP; Blind via hole; Copper plating; Damage; Drilling; FRP; GFRP; Insulation layer; Laser; Printed wiring boards

Indexed keywords

MULTI-LAYER BOARDS;

DRILLING; ELECTRIC WIRING; ELECTRONICS PACKAGING; ETCHING; INSULATION;

PRINTED CIRCUIT BOARDS;

LASER;

EID: 0036544316     PISSN: 13447912     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea.45.282     Document Type: Article

References (6)

1. Microvias printed circuit design
2. Developing build-up printed wiring board with 1-3 layer via for notebook PC
3. Laser cutting of fiber-reinforced polyesters
4. 2 laser as a heat source (Report 3)
5. 2 laser as a heat source (Report 2)
6. Evaluation of drilled hole quality in printed circuit boards