Developing Build-up Printed Wiring Board with 1-3 Layer Via for Notebook PC

journal of the japan institute of electronics packaging

Volumn 2, Issue 4, 2002, Pages 303-307

  Happoya, Akihiko ^a   Masaoka, Yasushi ^a   Takaki, Nobuyuki ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

Build up Printed Wiring Board; Characteristic; Cross Talk Noise; Impedance; Laser Drilling Method, B2it

Indexed keywords

EID: 85009541485     PISSN: 13439677     EISSN: 1884121x     Source Type: Journal    
DOI: 10.5104/jiep.2.303     Document Type: Article

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