Determination of copper(II) in electroless copper plating solutions containing cobalt(II) complexes as reducing agent

Transactions of the Institute of Metal Finishing

Volumn 79, Issue 2, 2001, Pages 77-78

  Norkus, E ^a   Norkus, P ^a   Vaiciuniene J ^a   Jaciauskiene J ^a  

^a VILNIUS UNIVERSITY   (Lithuania)

Author keywords

Copper(II); Electroless copper plating; Titrimetric determination

Indexed keywords

COBALT; COMPLEXATION; COPPER; ELECTROCHEMICAL ELECTRODES; REACTION KINETICS; STOICHIOMETRY; TITRATION;

ELECTROLESS COPPER PLATING SOLUTIONS; IODOMETRIC METHOD; TITRIMETRIC DETERMINATION; TITRIMETRIC METHODS;

ELECTROLESS PLATING;

EID: 0035266821     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.2001.11871367     Document Type: Article

References (17)

1. Die komplexonometrische Titration