Cylindrical pin-fin fan-sink heat transfer and pressure drop correlations

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 1, 2002, Pages 15-22

  Zheng, Ning ^a   Wirtz, Richard A ^a  

^a Reno   (United States)

Author keywords

Cooling of electronic equipment; Forced convection heat transfer; Measurement and data processing

Indexed keywords

COOLANTS; CORRELATION METHODS; DATABASE SYSTEMS; FINS (HEAT EXCHANGE); HEAT SINKS; PRESSURE DROP;

PIN-FINS;

HEAT CONVECTION;

EID: 0036506030     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.991170     Document Type: Article

References (4)

1. Heat transfer from pin-fins situated in an oncoming longitudinal flow which turns to cross flow
2. Thermal performance of pin-fin fan-sink assemblies
3. Methodology for predicting pin-fin fan-sink assembly performance