Methodology for predicting pin-fin fan-sink performance

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1998, Pages 303-309

  Wirtz, R A ^a   Zheng, Ning ^a  

^a UNIVERSITY OF NEVADA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; COOLANTS; DATABASE SYSTEMS; ELECTRONICS PACKAGING; MATHEMATICAL MODELS; NUSSELT NUMBER; PRESSURE DROP; THERMAL CONDUCTIVITY;

ASSEMBLY OPERATING POINT; FAN SINK ASSEMBLY;

FINS (HEAT EXCHANGE);

EID: 0031624688     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)