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Volumn 82, Issue 10, 1999, Pages 2919-2920

Prediction of a critical temperature for aluminate formation in alumina/copper-oxygen eutectic bonding

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BONDING; COPPER; INTERFACES (MATERIALS); MICROSTRUCTURE; OXYGEN; THERMODYNAMIC STABILITY;

EID: 0033204411     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.1999.tb02179.x     Document Type: Article
Times cited : (12)

References (17)
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  • 2
    • 0016988423 scopus 로고
    • A new hybrid power technique utilizing a direct copper to ceramic bond
    • Y. E. Sun and J. C. Driscol, "A New Hybrid Power Technique Utilizing a Direct Copper to Ceramic Bond," IEEE Trans. Electron Devices, 23, 961 (1976).
    • (1976) IEEE Trans. Electron Devices , vol.23 , pp. 961
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  • 3
    • 0020811559 scopus 로고
    • A thermodynamic analysis of the Cu - O system with an associated solution model
    • R. Schmid, "A Thermodynamic Analysis of the Cu - O System with an Associated Solution Model," Metall. Trans., 14B, 473-81 (1983).
    • (1983) Metall. Trans. , vol.14 B , pp. 473-481
    • Schmid, R.1
  • 4
    • 0022281033 scopus 로고
    • Eutectic bonding of copper to ceramics
    • M. Wittmer, "Eutectic Bonding of Copper to Ceramics," Mater. Res. Soc. Symp. Proc., 40, 393-98 (1985).
    • (1985) Mater. Res. Soc. Symp. Proc. , vol.40 , pp. 393-398
    • Wittmer, M.1
  • 5
    • 0024714075 scopus 로고
    • Role of oxygen in bonding copper to alumina
    • Y. Yoshino, "Role of Oxygen in Bonding Copper to Alumina," J. Am. Ceram. Soc., 72 [8] 1322-27 (1989).
    • (1989) J. Am. Ceram. Soc. , vol.72 , Issue.8 , pp. 1322-1327
    • Yoshino, Y.1
  • 6
    • 0000944743 scopus 로고
    • Interface structure and bond strength of copper-bonded alumina substrates
    • Y. Yoshino and H. Ohtsu, "Interface Structure and Bond Strength of Copper-Bonded Alumina Substrates," J. Am. Ceram. Soc., 74 [9] 2184-88 (1991).
    • (1991) J. Am. Ceram. Soc. , vol.74 , Issue.9 , pp. 2184-2188
    • Yoshino, Y.1    Ohtsu, H.2
  • 7
    • 84977696619 scopus 로고
    • Interface reactions between metals and ceramics: IV, wetting of sapphire by liquid copper oxygen alloys
    • A. C. D. Chaklader, A. M. Armstrong, and S. K. Misra, "Interface Reactions Between Metals and Ceramics: IV, Wetting of Sapphire by Liquid Copper Oxygen Alloys," J. Am. Ceram. Soc., 51 [11] 630-33 (1968).
    • (1968) J. Am. Ceram. Soc. , vol.51 , Issue.11 , pp. 630-633
    • Chaklader, A.C.D.1    Armstrong, A.M.2    Misra, S.K.3
  • 8
    • 0015651290 scopus 로고
    • Effect of oxygen on the reaction between copper and sapphire
    • T. E. O'Brien and A. C. D. Chaklader, "Effect of Oxygen on the Reaction Between Copper and Sapphire," J. Am. Ceram. Soc., 57 [8] 329-32 (1974).
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  • 11
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    • Interfacial reaction product and effect on strength of copper to alumina eutectic bonding
    • S. T. Kim and C. H. Kim, "Interfacial Reaction Product and Effect on Strength of Copper to Alumina Eutectic Bonding," J. Mater. Sci., 27, 2061-66 (1992).
    • (1992) J. Mater. Sci. , vol.27 , pp. 2061-2066
    • Kim, S.T.1    Kim, C.H.2
  • 12
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    • Structure and bond strength of a copper-alumina interface
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  • 16
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  • 17
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    • M.S. Thesis. Purdue University, West Lafayette, IN, December
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    • (1993)
    • Gonzalez, E.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.