-
1
-
-
0016511171
-
The direct bonding of metals to ceramics by the gas-metal eutectic method
-
J. F. Burgess, C. A. Neugebauer, and G. Flanagan, "The Direct Bonding of Metals to Ceramics by the Gas-Metal Eutectic Method," J. Electrochem. Soc., 122 [5] 688-90 (1975).
-
(1975)
J. Electrochem. Soc.
, vol.122
, Issue.5
, pp. 688-690
-
-
Burgess, J.F.1
Neugebauer, C.A.2
Flanagan, G.3
-
2
-
-
0016988423
-
A new hybrid power technique utilizing a direct copper to ceramic bond
-
Y. E. Sun and J. C. Driscol, "A New Hybrid Power Technique Utilizing a Direct Copper to Ceramic Bond," IEEE Trans. Electron Devices, 23, 961 (1976).
-
(1976)
IEEE Trans. Electron Devices
, vol.23
, pp. 961
-
-
Sun, Y.E.1
Driscol, J.C.2
-
3
-
-
0020811559
-
A thermodynamic analysis of the Cu - O system with an associated solution model
-
R. Schmid, "A Thermodynamic Analysis of the Cu - O System with an Associated Solution Model," Metall. Trans., 14B, 473-81 (1983).
-
(1983)
Metall. Trans.
, vol.14 B
, pp. 473-481
-
-
Schmid, R.1
-
4
-
-
0022281033
-
Eutectic bonding of copper to ceramics
-
M. Wittmer, "Eutectic Bonding of Copper to Ceramics," Mater. Res. Soc. Symp. Proc., 40, 393-98 (1985).
-
(1985)
Mater. Res. Soc. Symp. Proc.
, vol.40
, pp. 393-398
-
-
Wittmer, M.1
-
5
-
-
0024714075
-
Role of oxygen in bonding copper to alumina
-
Y. Yoshino, "Role of Oxygen in Bonding Copper to Alumina," J. Am. Ceram. Soc., 72 [8] 1322-27 (1989).
-
(1989)
J. Am. Ceram. Soc.
, vol.72
, Issue.8
, pp. 1322-1327
-
-
Yoshino, Y.1
-
6
-
-
0000944743
-
Interface structure and bond strength of copper-bonded alumina substrates
-
Y. Yoshino and H. Ohtsu, "Interface Structure and Bond Strength of Copper-Bonded Alumina Substrates," J. Am. Ceram. Soc., 74 [9] 2184-88 (1991).
-
(1991)
J. Am. Ceram. Soc.
, vol.74
, Issue.9
, pp. 2184-2188
-
-
Yoshino, Y.1
Ohtsu, H.2
-
7
-
-
84977696619
-
Interface reactions between metals and ceramics: IV, wetting of sapphire by liquid copper oxygen alloys
-
A. C. D. Chaklader, A. M. Armstrong, and S. K. Misra, "Interface Reactions Between Metals and Ceramics: IV, Wetting of Sapphire by Liquid Copper Oxygen Alloys," J. Am. Ceram. Soc., 51 [11] 630-33 (1968).
-
(1968)
J. Am. Ceram. Soc.
, vol.51
, Issue.11
, pp. 630-633
-
-
Chaklader, A.C.D.1
Armstrong, A.M.2
Misra, S.K.3
-
8
-
-
0015651290
-
Effect of oxygen on the reaction between copper and sapphire
-
T. E. O'Brien and A. C. D. Chaklader, "Effect of Oxygen on the Reaction Between Copper and Sapphire," J. Am. Ceram. Soc., 57 [8] 329-32 (1974).
-
(1974)
J. Am. Ceram. Soc.
, vol.57
, Issue.8
, pp. 329-332
-
-
O'Brien, T.E.1
Chaklader, A.C.D.2
-
9
-
-
0024922915
-
Study of copper-alumina bonding
-
C. Beraud, M. Courbiere, C. Esnouf, D. Juve, and D. Treheux, "Study of Copper-Alumina Bonding," J. Mater. Sci., 24, 4545-54 (1989).
-
(1989)
J. Mater. Sci.
, vol.24
, pp. 4545-4554
-
-
Beraud, C.1
Courbiere, M.2
Esnouf, C.3
Juve, D.4
Treheux, D.5
-
11
-
-
0000077946
-
Interfacial reaction product and effect on strength of copper to alumina eutectic bonding
-
S. T. Kim and C. H. Kim, "Interfacial Reaction Product and Effect on Strength of Copper to Alumina Eutectic Bonding," J. Mater. Sci., 27, 2061-66 (1992).
-
(1992)
J. Mater. Sci.
, vol.27
, pp. 2061-2066
-
-
Kim, S.T.1
Kim, C.H.2
-
12
-
-
84985097650
-
Structure and bond strength of a copper-alumina interface
-
Y. Yoshino and T. Shibata, "Structure and Bond Strength of a Copper-Alumina Interface," J. Am. Ceram. Soc., 75 [10] 2756-60 (1992).
-
(1992)
J. Am. Ceram. Soc.
, vol.75
, Issue.10
, pp. 2756-2760
-
-
Yoshino, Y.1
Shibata, T.2
-
16
-
-
0029756461
-
Spontaneous infiltration of alumina by copper-oxygen alloys
-
E. J. Gonzalez and K. P. Trumble, "Spontaneous Infiltration of Alumina by Copper-Oxygen Alloys," J. Am. Ceram. Soc., 79 [1] 114-20 (1996).
-
(1996)
J. Am. Ceram. Soc.
, vol.79
, Issue.1
, pp. 114-120
-
-
Gonzalez, E.J.1
Trumble, K.P.2
-
17
-
-
0343354910
-
-
M.S. Thesis. Purdue University, West Lafayette, IN, December
-
E. J. Gonzalez; M.S. Thesis. Purdue University, West Lafayette, IN, December 1993.
-
(1993)
-
-
Gonzalez, E.J.1
|