Residual stress of TiNi shape memory alloy thin films with (111) single-crystal silicon wafer

Materials Transactions

Volumn 43, Issue 3, 2002, Pages 566-570

  Wu, Tingbin ^a   Jiang, Bohong ^a   Qi, Xuan ^a   Liu, Yushu ^a   Xu, Dong ^a   Wang, Li ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Nickel; Residual stress; Shape memory alloy; Thin films; Titanium

Indexed keywords

ANNEALING; CRYSTALLIZATION; MAGNETRON SPUTTERING; RESIDUAL STRESSES; SHAPE MEMORY EFFECT; SILICON WAFERS; SINGLE CRYSTALS; TENSILE STRESS; THERMAL STRESS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

FILM THICKNESS; TITANIUM NICKEL ALLOY; X RAY GLANCING AND COUNTOUR METHOD;

TITANIUM ALLOYS;

EID: 0036493419     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.43.566     Document Type: Article

References (16)