Relaxation and recovery of extrinsic stress in sputtered titanium-nickel thin films on (100)-Si

Materials Science and Engineering: A

Volumn 273-275, Issue , 1999, Pages 722-726

  Grummon, David S ^a   Zhang, Jinping ^a   Pence, Thomas J ^a  

^a Michigan State University   (United States)

Author keywords

Microelectromechanical devices; Nitinol; Shape memory; Stress; Thin films; TiNi

Indexed keywords

BINARY ALLOYS; COOLING; HYSTERESIS; MICROELECTROMECHANICAL DEVICES; PHASE TRANSITIONS; SHAPE MEMORY EFFECT; STRESS RELAXATION; TENSILE STRESS; THIN FILMS; TITANIUM ALLOYS; X RAY DIFFRACTION ANALYSIS;

DISPLACIVE TRANSFORMATION; TITANIUM NICKEL ALLOY;

METALLIC FILMS;

EID: 0000893478     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(99)00404-9     Document Type: Article

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