Modeling of photoresist erosion in plasma etching processes

IEEE Transactions on Plasma Science

Volumn 30, Issue 1 I, 2002, Pages 114-115

  Zhang, Da ^a   Rauf, Shahid ^a   Sparks, Terry ^a  

^a MOTOROLA INC   (United States)

Author keywords

Gas discharges; Plasma applications; Plasma materials processing applications

Indexed keywords

EROSION; IONS; PHOTORESISTS; PLASMA APPLICATIONS; PLASMA DENSITY; PLASMA SIMULATION; REACTION KINETICS; SPUTTERING; SURFACE REACTIONS; SURFACE TREATMENT;

ION ACTIVATED SURFACES; ION SPUTTERING;

PLASMA ETCHING;

EID: 0036478129     PISSN: 00933813     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPS.2002.1003950     Document Type: Article

References (4)

1. 2 with equipment and feature scale models
2. Microtrenching resulting from specular reflection during chlorine etching of silicon
3. Molecular dynamics simulation of Cu and Ar ion Sputtering of Cu (111) Surfaces
4. 8 discharge