Creep and stress-rupture behavior of Y2O3-Nd2O3-doped silicon nitrides with different additive contents

Journal of the European Ceramic Society

Volumn 22, Issue 2, 2002, Pages 237-245

  Cao, Jian Wu ^a   Okada, Akira ^a   Hirosaki, Naoto ^b  

^a JAPAN FINE CERAMICS CENTER   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

Creep; Electron microscopy; Si3N4; Sintering aid; Stress rupture

Indexed keywords

CRACK PROPAGATION; CREEP TESTING; MICROSTRUCTURE; SINTERING; STRESS ANALYSIS; TENSILE TESTING; YTTRIUM COMPOUNDS;

STRESS-RUPTURE BEHAVIOR;

SILICON NITRIDE;

ADDITIVE; CREEP; HIGH TEMPERATURE CORROSION; SILICON NITRIDE; STRESS-STRAIN ANALYSIS;

EID: 0036466685     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0955-2219(01)00250-3     Document Type: Article

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