Thermal design methodology for high-heat-flux single-phase and two-phase micro-channel heat sinks

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 347-359

  Qu, Weilin ^a   Mudawar, Issam ^a  

^a PURDUE UNIVERSITY   (United States)

Author keywords

Boiling; Boiling incipience; Heat sink; High heat flux; Micro channel; Phase change; Pressure drop

Indexed keywords

BUBBLES (IN FLUIDS); COMPRESSIBILITY OF LIQUIDS; COMPUTER SIMULATION; COOLING; HEAT FLUX; HEAT TRANSFER; NUMERICAL ANALYSIS; PRESSURE DROP;

THERMAL DESIGN;

HEAT SINKS;

EID: 0036455919     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (29)

1. D.B. Tuckerman and R.F.W. Pease, "High-performance Heat Sinking for VLSI," IEEE Electronic Devices Letters, vol. EDL-2, no. 5, pp. 126-129, May 1981.
2. T. Kishimito and T. Ohsaki, "VLSI Packaging Technique Using Liquid-cooled Channels," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT-9, no. 4, pp. 328-335, Dec. 1986.
3. D. Copeland, et al., "Manifold Microchannel Heat Sinks: Theory and Experiment," Advances in Electronic Packaging, ASME EEP-vol. 10, no. 2, pp. 829-835, 1995.
4. K. Kawano, et al., "Micro Channel Heat Exchanger for Cooling Electrical Equipment," Proceedings of the ASME Heat Transfer Division, ASME, HTD-vol. 361-3/PID-vol. 3, pp. 173-180, 1998.
5. T.M. Harms, et al., "Developing Convective Heat Transfer in Deep Rectangular Microchannels," International Journal of Heat and Fluid Flow, vol. 20, no. 2, pp. 149-157, Apr. 1999.
6. W. Qu and I. Mudawar, "Experimental and Numerical Study of Pressure Drop and Heat Transfer in a Single-Phase Micro-Channel Heat Sink," International Journal of Heat and Mass Transfer, in press.
7. R.J. Phillips, "Micro-channel Heat Sinks," Advances in Thermal Modeling of Electronic Components, vol. 2, pp. 109-184, ASME Press, New York, 1990.
8. R.W. Knight, et al., "Heat Sink Optimization with Application to Microchannels," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 15, no. 5, pp. 832-842, Oct. 1992.
9. S.F. Choquette, et al., "Optimum Design of Microchannel Heat Sinks," Micro-Electro-Mechanical Systems (MEMS), DSC-vol. 59, pp. 115-126, ASME, 1996.
10. H.H. Bau, "Optimization of Conduits' Shape in Micro Heat Exchangers," International Journal of Heat and Mass Transfer, vol. 41, no. 18, pp. 2717-2723, Sep. 1998.
11. D.Y. Lee and K. Vafai, "Comparative Analysis of Jet Impingement and Microchannel Cooling for High Heat Flux Applications," International Journal of Heat and Mass Transfer, vol. 42, no. 9, pp. 1555-1568, May 1999.
12. A. Weisberg, et al., "Analysis of Microchannels for Integrated Cooling," International Journal of Heat and Mass Transfer, vol. 35, no. 10, pp. 2465-2474, Oct. 1992.
13. X. Yin and H.H. Bau, "Uniform Channel Micro Heat Exchangers," Journal of Electronic Packaging, vol. 119, no. 2, pp. 89-93, Jun. 1997.
14. A.G. Fedorov and R. Viskanta, "Three-Dimensional Conjugate Heat Transfer in the Microchannel Heat Sink for Electronic Packaging," International Journal of Heat and Mass Transfer, vol. 43, no. 3, pp. 399-415, Feb. 2000.
15. W. Qu and I. Mudawar, "Analysis of Three-Dimensional Heat Transfer in Micro-Channel Heat Sinks," International Journal of Heat and Mass Transfer, in review.
16. W. Qu and I. Mudawar, "Prediction and Measurement of Incipient Boiling Heat Flux in Micro-Channel Heat Sinks," International Journal of Heat and Mass Transfer, in review.
17. M.B. Bowers and I. Mudawar, "High Flux Boiling in Low Flow Rate, Low Pressure Drop Mini-channel and Microchannel Heat Sinks," International Journal of Heat and Mass Transfer, vol. 37, no. 2, pp. 321-332, Jan. 1994.
18. M.B. Bowers and I. Mudawar, "Two-phase Electronic Cooling Using Mini-channel and Micro-channel Heat Sinks: Part 1 - Design Criteria and Heat Diffusion Constraints," Journal of Electronic Packaging, vol. 116, no. 4, pp. 290-297, Dec. 1994.
19. M.B. Bowers and I. Mudawar, "Two-phase Electronic Cooling Using Mini-channel and Micro-channel Heat Sinks: Part 2 - Flow Rate and Pressure Drop Constraints," Journal of Electronic Packaging, vol. 116, no. 4, pp. 298-305, Dec. 1994.
20. L. Zhang, et al., "Measurement and Modeling of Two-phase Flow in Microchannels with Nearly-constant Heat Flux Boundary Conditions," Micro-Electro-Mechanical Systems (MEMS) - 2000, MEMS-Vol.2, pp. 129-135, ASME, 2000.
21. L. Jiang, et al., "Forced Convection Boiling in a Microchannel Heat Sink," Journal of Microelectromechanical Systems, vol. 10, no. 1, pp. 80-87, Mar. 2001.
22. X.F. Peng and B.X. Wang, "Forced Convection and Flow Boiling Heat Transfer for Liquid Flowing Through Microchannels," International Journal of Heat and Mass Transfer, vol. 36, no. 14, pp. 3421-3427, Sep. 1993.
23. T.S. Ravigururajan, "Impact of Channel Geometry on Two-phase Flow Heat Transfer Characteristics of Refrigerants in Microchannel Heat Exchangers," Journal of Heat Transfer, vol. 120, no. 2, pp. 485-491, May 1998.
24. S.V. Patankar, Numerical Heat Transfer and Fluid Flow, Hemisphere, Washington DC, 1980.
25. S.V. Patankar, "A Numerical Method for Conduction in Composite Materials, Flow in Irregular Geometries and Conjugate Heat Transfer," Proceedings of the sixth International Heat Transfer Conference, Vol.3, pp. 297-302, Hemisphere, 1978.
26. R.A.M. Al-Hayes and R.H.S. Winterton, "Bubble Diameter in Detachment in Flowing Liquids," International Journal of Heat and Mass Transfer, vol. 24, no. 2, pp. 223-230, Feb. 1981.
27. R.H.S. Winterton, "Flow Boiling: Prediction of Bubble Departure," International Journal of Heat and Mass Transfer, vol. 27, no. 8, pp. 1422-1424, Aug. 1984.
28. R.K. Shah and A.L. London, Laminar Flow Forced Convection in Ducts: a Source Book for Compact Heat Exchanger Analytical Data, Supl. 1, Academic press, New York, 1978.
29. rd edition, Oxford University Press, Oxford,1994