Lead free dielectric tape system for high frequency applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4587, Issue , 2001, Pages 133-137

  Feingold, A H ^a   Wahlers, R L ^a   Stein, S J ^a  

^a Electro Science Lab Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; COST EFFECTIVENESS; DIELECTRIC PROPERTIES OF SOLIDS; ELECTRIC CONDUCTORS; FERRITES; INDUCTANCE; INTERFACES (MATERIALS); LEAD COMPOUNDS; SCANNING ELECTRON MICROSCOPY;

DIELECTRIC TAPE SYSTEMS;

DIELECTRIC MATERIALS;

EID: 0035772533     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

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2. K.B. Shim, N.T. Cho, S.W. Lee, Silver Diffusion and Microstructure in LTCC Multilayer Couplers for High Frequency Applications; J. Materials Science,v35, 2000, pp 813-820.
3. D.L. Wilcox, R.F. Huang and R. Kommruseh, "The Multilayer Ceramic Integrated Circuit (MCIC) Technology: An Enabler for the Integration of Wireless Radio Functions" Advancing Microelectronics, vol 26, no.4 pp 13-18.
4. A.H. Feingold, C. Huang, and S.J. Stein,; Low K, Low Loss, Low Fire Tape System for Microwave Applications; Proceedings of IMAPS-Europe Prague June 2000; pp. 163-168.
5. F.S. Burkett; Improved Designs for Thin Film Inductors; Proceedings of the 1971 ECC Conference. Pp 184-194.