High-density packaging for wrist-wearable medical devices

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 175-180

  Hirt, Etienne ^a   Scheffler, Michael ^a  

^a Art of Technology   (Switzerland)

Author keywords

Biocompatible; COB; Monitoring device; Wrist wearable

Indexed keywords

APPLICATION SPECIFIC INTEGRATED CIRCUITS; BIOCOMPATIBILITY; COST EFFECTIVENESS; ELECTRONIC MEDICAL EQUIPMENT; HEALTH CARE; INTEGRATED CIRCUIT LAYOUT; LIFE CYCLE; MINIATURE INSTRUMENTS; PATIENT MONITORING;

HIGH DENSITY PACKAGING; SEQUENTIAL DESIGN APPROACH; WRIST-WEARABLE MEDICAL DEVICES;

ELECTRONICS PACKAGING;

EID: 0036450142     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. http://www.medtronic.com/corporate/more_history.html
2. "High density interconnects and flexible hybrid assemblies for active biomedical implants", J.-U. Meyer, T. Stieglietz, O. Scholz, W. Haberer, and H.-J. Beutel, IEEE T-Advanced Packaging, 24, (3), p. 366-374, 2001.
3. http://www.iso.ch/iso/en/ISOOnline.frontpage
4. "Esprit project 26261: LAP, Low cost large area panel processing of MCM-D substrates and packages," http://www.ife.ee.ethz.ch/mc/lap, 1998-2000.
5. "High Density Packaging of Medical Devices", E. Hirt, 2nd MEDICS Workshop on Micropackaging and Interconnection Technologies for Innovative Biomedical Devices, Sulzbach; Germany, Dec 5th, 2000.
6. "Biotronik", T. Töpper, www.izm.fhg.de, 1999.