Excimer laser applications in integrated circuit packaging

Materials Research Society Symposium - Proceedings

Volumn 397, Issue , 1996, Pages 323-328

  Lu, Y F ^a   Hong, M H ^a   Chan, D S H ^a   Low, T S ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EXCIMER LASERS; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); LASER ABLATION; SURFACE ROUGHNESS; SURFACE STRUCTURE; SURFACE TREATMENT;

HYDROGEN FLAME OFF; INK MARKS; INTEGRATED CIRCUIT LEADFRAME; LASER DEFLASHING; LASER DEMARKING; LASER PARAMETERS; MOLD FLASH; PIN COUNT PACKAGES;

LASER APPLICATIONS;

EID: 0029751709     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)