Micromachined thin-film multijunction thermal converters developed at KRISS

CPEM Digest (Conference on Precision Electromagnetic Measurements)

Volumn , Issue , 2002, Pages 32-33

  Park, S I ^a   Kwon, S W ^a   Kim, K J ^a   Woo, B C ^a   Lee, Y H ^a  

^a Korea Research Institute of Standards and Science   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ETCHING; FINITE ELEMENT METHOD; MICROMACHINING; NUMERICAL ANALYSIS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SILICON WAFERS; THERMAL CONDUCTIVITY OF SOLIDS; THERMOCOUPLES; THIN FILMS;

ANISOTROPIC ETCHING; MULTIJUNCTION THERMAL CONVERTERS; NUMERIC TEMPERATURE PROFILE ANALYSIS; SEEBECK COEFFICIENT; TEMPERATURE COEFFICIENT OF RESISTANCE;

ELECTRIC CONVERTERS;

EID: 0036391346     PISSN: 05891485     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. M. Klonz and T. Weimann, "Accurate thin film multijunction thermal converter on a silicon chip," IEEE Trans. Instrum. Meas., Vol. IM-38, pp. 335-337, 1989.
2. J. R. Kinard, et al., "Performance of multilayer thin-film multijunction thermal converters," IEEE Trans. Instrum. Meas., Vol. IM-44, pp. 383-386, 1995.
3. 4 sandwich system," Thin Solid Films, Vol. 188, pp. 27-33, 1990.
4. T. F. Wunsch, et al., "A new fabrication process for planar thin-film multijunction thermal converters," Digest of CPEM 2000, pp. 387-388.