Thermoelectric module for low temperature applications

Materials Research Society Symposium - Proceedings

Volumn 691, Issue , 2002, Pages 121-129

  Lal, Sangeeta ^a   Loo, Sim ^a   Chung, Duck Young ^b   Kyratsi, Theodora ^b   Kanatzidis, Mercouri G ^b   Cauchy, Charles ^a   Hogan, Timothy P ^a  

^a Tellurex Corporation   (United States)

^b MICHIGAN STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BISMUTH ALLOYS; CESIUM ALLOYS; COMPUTER SIMULATION; COOLING SYSTEMS; LOW TEMPERATURE EFFECTS; THERMAL GRADIENTS; THERMOELECTRIC EQUIPMENT; TRANSPORT PROPERTIES;

BISMUTH ANTIMONIDE; CESIUM BISMUTH TELLURIDE; THERMOELECTRIC COOLING DEVICE; THERMOELECTRIC MODULE;

THERMOELECTRICITY;

EID: 0036351534     PISSN: 02729172     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. 6: A high-performance thermoelectric material for low-temperature applications
2. Bi-Sb alloys for magneto-thermoelectric and thermomagnetic cooling
3. Thermoelectric properties of bismuth-antimony alloys
4. Transport measurement system for characterization of new thermoelectric materials
5. Pulsed method for simultaneous measurement of electric thermopower and heat conductivity at low temperatures